ميكانيكي XG-50 إصلاح اللحيم لصق SMD SMT بغا لحام لصق الجريان XG50
سمات:
100% منتج جديد وعالي الجودة
Unique recipes, perfect performance, easy to weld, solder bright and full.
Good soldering and welding tool
تخصيص:
Material: Plastic+solder paste
Color: As picture shown
Type: XG-50
Microns: 25-45um
طلب:
Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc
Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive
Product information:
Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
طَرد:
1*solder tin paste
المراجعات
لا توجد مراجعات بعد.