الوصف

Rework Liquid Flux 125mL for Repairing SMT/BGA Chipset Solder Balls

For repairing (SMT/BGA) chipset solder balls, soldering and reballing of chipset for PCs, laptops, smartphones and all sensitive electronic components by using tin soldering iron, hot air soldering station and SMT/BGA rework station.

Features:
• Quick repairing of oxidized solder balls for chipset without lifting.
• Fast reflow and evenly spread under (BGA) chipset.
• High quality and activity.
• Non conductive, non corrosive and fungus resistant.
• No residue after rework and easy cleaning.

Usage:
• This flux can be used in both automated and manual soldering applications, it is great for general purpose soldering of electronic boards, wires, semiconductors and SMD/SMT/BGA.
• It is also ideal for solder coating or tinning leads, it may be applied by spray, or foam for tin soldering applications.

Usage Recommendations:
• Clean the surface (Clear of any residues or dust).
• Put a little bit of flux.
• Use soldering iron with soldering wick.
• Use hot air soldering station for (SMT) ICs rework at (max180°C).
• Use thinner or any alcohol for cleaning.

Notes:
• For best results, follow the usage recommendations.
• Suitable with dip or wave soldering.
• Not suitable with welding by fusion or flame.

Safety Precautions:
• Close after using & keep away from children.
• Use enough water when eyes or wounds are touched.

Appearance: The flux is a light yellow liquid, packaged in a transparent plastic bottle – (Net Capacity) 125mL.

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