QIANLI 008 Glue Remover Blade Flexible Tin Blade Set

QIANLI 008 Glue Remover Blade Flexible Tin Blade Set is a professional precision repair tool designed for safe glue removal, adhesive scraping, solder mask cleaning, and delicate motherboard maintenance. It is especially useful for mobile phone repair technicians working on CPU, IC, BGA chip areas, small electronic components, screen frames, adhesive residue, and sensitive board surfaces that require controlled scraping without aggressive damage.

Product Overview

The QIANLI 008 glue remover tool is designed for technicians who need a thin, flexible, and controllable blade for detailed repair work. During smartphone motherboard repair, glue residue around chips, BGA areas, CPU layers, IC modules, and small components can be difficult to remove using ordinary tools. A thick or rigid scraper may damage pads, scratch the board surface, or apply too much pressure. This tool helps make the process more controlled by using a flexible thin blade mounted into a pen-style metal handle.

The tool is suitable for removing adhesive from mobile phones, PCBs, IC chip edges, BGA chip surroundings, CPU glue, screen adhesive residue, and other repair surfaces where accuracy is important. The blade has a slim shape that can reach narrow areas, while the curved tip helps the technician work around components and edges with better access. It is a practical accessory for mobile service centers, motherboard repair workshops, screen repair benches, and electronics maintenance setups.

The handle is made from aluminum alloy according to the supplied images, giving the tool a lightweight but firm structure. The body has a non-slip center grip with fine grooves that improve hand control during detailed scraping. The front head uses a limit fixed head and a plated anti-oxidation copper head design according to the image data, allowing the blade to be installed securely and removed when replacement is needed. The structure is easy to disassemble and assemble, making blade replacement simple for daily workshop use.

The QIANLI 008 blade is described as a flexible tin blade for glue removal. Its thin and flexible profile makes it useful for working on delicate repair areas where a standard steel blade may be too aggressive. It can help remove glue residue, soften scraping around ICs, clean adhesive from small parts, and assist in motherboard BGA chip cleaning when used carefully by a trained technician.

Because this is a precision blade tool, the technician should use it with controlled hand pressure and proper repair technique. It should not be forced under components or used in a way that may cut tracks, pads, or nearby small parts. When used correctly, it can reduce the need for repeated scraping and help improve cleaning accuracy around chips and motherboard repair areas.

Key Features

• Professional glue removal tool: designed for mobile phone, PCB, IC, CPU, and BGA repair work.
• Flexible thin blade: helps remove glue residue and adhesive layers with better control.
• Pen-style handle: gives a comfortable and precise grip for detailed maintenance tasks.
• Aluminum alloy handle: lightweight, durable, and suitable for long workshop use.
• Non-slip center grip: grooved design helps improve control while scraping.
• Limit fixed head: supports secure blade holding during repair work.
• Plated anti-oxidation copper head: helps improve durability and blade clamping quality according to image data.
• Easy blade replacement: structure can be disassembled and assembled easily.
• Useful for small chips: suitable for delicate glue cleaning around small motherboard components.
• Workshop-friendly design: compact, reusable, and easy to store inside the supplied box.

Technical Specifications

Applications

• Removing glue residue around mobile phone motherboard chips.
• Cleaning adhesive from BGA, CPU, IC, and small electronic component areas.
• Scraping solder mask layers carefully during repair preparation.
• Removing screen frame glue and adhesive residue during phone repair.
• Assisting in CPU upper layer and chip glue removal work when used by trained technicians.
• Cleaning tight spaces where standard blades cannot reach easily.
• Professional mobile repair benches, service centers, and electronics workshops.

Repair Usage Notes

The blade should be used with light pressure and controlled movement. For stubborn glue, the technician should prepare the area properly using safe repair methods before scraping. Do not push the blade aggressively under chips or components. Always keep the blade angle low and stable to reduce the chance of damaging PCB tracks, pads, or nearby tiny parts.

The handle design makes the tool easier to control than loose blades. The grooved grip improves stability, while the replaceable blade structure allows technicians to maintain a sharp and suitable working edge. The tool is best used by experienced repair technicians who understand motherboard layers and component sensitivity.

Package Contents

• 1 × QIANLI 008 Glue Remover Handle
• 3 × Flexible Glue Remover Blades according to supplied product images
• 1 × Storage Box

Important Notes

• This is a sharp precision repair tool and should be handled carefully.
• Keep away from children and non-technical users.
• Use low pressure when cleaning around motherboard chips.
• Do not use the blade on live circuits or powered devices.
• Disconnect the device battery before motherboard repair work.
• Blade shape, packaging, and included blade count may vary slightly by batch.
• For professional repair use only.