Metallic Solder Paste PRO 15g for PCB/SMD/BGA/PGA

160.00 EGP

Metallic Solder Paste PRO 15g for PCB/SMD/BGA/PGA

SKU Metallic Solder Paste PRO 15g SKU SYS X7211 Availability In stock
Quantities are confirmed after reviewing your order. Orders are normally prepared and shipped within 3–5 business days. Online availability does not necessarily mean the product is currently available at the branch. تأكيد الكميات بيتم بعد مراجعة الأوردر، وتجهيز وشحن الطلب بيستغرق عادة من 3 إلى 5 أيام عمل. توافر المنتج على الموقع لا يعني بالضرورة توافره داخل الفرع، لذلك اعمل الأوردر مسبقًا لتأكيد الكمية وتجهيزه.
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Description

Metallic Solder Paste PRO 15g for PCB/SMD/BGA/PGA

Metallic Solder Paste PRO (Mixture of tin alloy powder & paste flux) for repairing electronic boards, PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances by using tin soldering iron, hot air soldering station and SMT/BGA rework station.

Specification:
• Particle Size:25-40 Micron.
• Alloy: Sn63/Pb37.
• Melting Point: 185-240 Celsius.

Features:
• Suitable to stencil printing (holes larger than 0.40mm).
• Good conductivity and oxidation resistance.
• High purity, stable viscosity and soft soldering.
• Bright and full solder joints.
• No residue solid after rework and easy cleaning.
• Halogen free.
• 75% Metal Content.

Usage:
• Repairing electronic boards such as PCB/SMD/BGA/PGA for PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances.
• Reballing BGA chipset with reballing stencil (holes larger than 0.40mm).
• Repairing phones, as well as replacement SMD component, micro switches and charging connectors.
• Soldering electrical control boards.
• Soldering all copper alloys, wires, lithium ion batteries and solderable surfaces as nickel strips.

Usage Recommendations (very important):
• Follow safety precautions & notes.
• Clean the surface (Clear any residues or dust).
• Put a very little bit of solder paste before soldering.
• Use a suitable soldering iron tip with the target area.
• Use a suitable soldering iron with the target size.
• Use a suitable soldering station with the target component.
• Use a wet soldering sponge for cleaning the tip and during soldering.
• Use thinner or any alcohol for cleaning.

Notes:
• For best results, follow the usage recommendations.
• Don’t put soldering iron tip in the solder paste.
• Not suitable with welding by fusion or flame.

Safety Precautions:
• Close after using & keep away from children.
• Use enough water when eyes or wounds are touched.

Appearance:
The solder paste is a soft paste, packaged in a round plastic can – net weight 15g.

Thanks for Your Trust

Metallic Solder Paste PRO 15g for PCB/SMD/BGA/PGA
Metallic Solder Paste PRO 15g for PCB/SMD/BGA/PGA
Metallic Solder Paste PRO 15g for PCB/SMD/BGA/PGA
Metallic Solder Paste PRO 15g for PCB/SMD/BGA/PGA

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